本次研討會從中國移動的角度概述了5G無線發展中的技術與挑戰。5G將提高10倍以上的網絡傳輸能力，其消耗的能量卻只占現有4G網絡的一小部分。Section 1 對系統和架構問題以及可能的解決方案進行高水平深入的分析。Section 2 針對5G原型機的研制開發、實際的挑戰和測量技術分析5G技術的實際應用。

主講人與報告題目：

Introduction of 5G Cellular Challenges & Technologies with Workshop Overview: Corbett Rowell

Section 1: 系統級和理論工作
- Architectural and signaling design towards diverse traffic profiles: Li Gang (China Mobile)
- C-RAN Architecture: Huang Jin Ri (China Mobile)
- Spectral-Efficiency and Energy-Efficiency Co-Design: Xu Zhi Kun (China Mobile)
- Large Scale Antenna System & Full Duplex Analysis: Han Shuang Feng (China Mobile)

Section 2: 實際應用
- Section Overview & Large Scale Antenna System Prototype for 4G TD-LTE: Corbett Rowell
- Small Cell Capacity Enhancements: Eric Tsang (ASTRI) - 8. Measurement of Massive MIMO and Active Base-station: Lars Jacob Foged (Satimo)
- Workshop Summary

3、多層/3D 微波毫米波MCM/SoP：最新進展與挑戰

由于更高頻的諸多優勢，微波和毫米波（MMW）不斷引起商業和軍事應用的興趣。單片集成電路（MMIC/RFIC）技術提供了大量制作高可重復性、低成本的毫米波電路的途徑。但是，高頻時模塊/電路組裝技術更加復雜，成本更高。多層/3D集成技術，如多芯片模塊（MCM）或者系統級封裝（SoP），是以低成本實現更多產品功能和更大可重復性的極好的系統集成化技術，因而得到廣泛的歡迎。過去的十年間，這些技術已經有了巨大的發展，但是也仍有許多挑戰亟待解決。本次研討會將進行廣泛的展示，并將提供一個對多層先進的MCM/SoP技術（包括LTCC、LCP、可感光厚膜和BCB）的完整的概要和理解，以及它們現在的挑戰，還將使參與者對最近的重要進展，包括MMICs與封裝（SOC和SOP）的協同設計以及新興的MCM/SoP應用的混合集成技術，增進一定的了解。主講人是來自工業界和學術界的專家和主要貢獻者。

主講人與報告題目：

特邀報告：Kamal K. Samanta, title: “Ceramic Based Novel Multilayer and Miniaturized RF/Millimetre-Wave Components and Highly Integrated Mm-Wave Modules”

- "Co-Design of CMOS SOC/SOP for Commercial mmW Applications" Dr. Joy Laskar, IEEE Fellow, Partner Anayas360, USA

- “mmW Single-chip Radar and Its Packaging Concepts: Performance and Cost Perspective”. Dr.-Ing. Yaoming Sun Scientist IHP Microelectronics, Frankfurt, Germany

- “High Performance Multilayer MCM/SoP Components for Novel Microwave and Mm-wave Modules”. Dr. Kamal K Samanta, Senior Principal Engineer & Project Manager, Milmega/Teseq Ltd, Ryde, UK

- “Multilayer 3D LTCC and IPD integration platforms and components from RF to Millimeter Wave Applications” Dr. Tauno Vähä-Heikkilä, Principal Scientist, VTT Technical Research Centre of Finland, Finland

- “Inkjet-Printed Nanotechnology-enabled RFID, Internet of Things and “Zero-Power” Wireless Sensor Nodes”. Prof. Manos M. Tentzeris, IEEE Fellow and Distinguished Microwave Lecturer Georgia Tech, USA

4、基板合成波導組件與系統

基片集成波導技術越來越吸引了更多的學術界和工業界的關注，可以實現很大范圍的組件和天線的多種應用。本次研討會將展示新型電路技術、創新的材料和制造技術、前所未有的領域的新應用等方面的最新進展。來自亞洲、歐洲和美洲的著名的專家將介紹他們的最新研究進展，并與觀眾進行互動交流。

主講人與報告題目：

- Ke Wu (Canada) Title: Extension and Expansion of Substrate Integrated Circuits into the Development of Next Generation Wireless Technologies

- Eric Rius (France) Title: High K ceramic for the size reduction of RF filters)

- Wen Wang, Robab Kazemi, Aly E. Fathy Title: Wide Band Feeds and Antennas Implemented using SIW Structures

- Wei Hong (China) Title: TBD

- Ziqiang Xu (China) Title: Substrate Integrated Waveguide Components Based on LTCC technology

- Maurizio Bozzi (Italy) Title: SIW Components based on Novel Materials for Wireless Sensor Networks and the Internet of Things

- Wenquan Che (China), Haidong Chen, Wenjie Feng, Y. L. Chow Title: The Current Researches and Next Trends of Substrate Integrated Waveguide